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CMOS Plasma and Process Damage Kirk Prall
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CMOS Plasma and Process Damage
Kirk Prall
Readers will learn how plasma and process damage results from the high-energy processes that are used in chip manufacturing, causing harm to the chips, functional failure and reliability problems.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Publicado | 17 de mayo de 2025 |
| ISBN13 | 9783031890284 |
| Editores | Springer International Publishing AG |
| Páginas | 466 |
| Dimensiones | 162 × 244 × 32 mm · 848 g |
| Lengua | Alemán |
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