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Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
| Medios de comunicación | Libros Hardcover Book (Libro con lomo y cubierta duros) |
| Pendiente de lanzamiento | 20 de octubre de 2026 |
| ISBN13 | 9781032959436 |
| Editores | Taylor & Francis Ltd |
| Páginas | 516 |
| Dimensiones | 150 × 220 × 20 mm · 453 g |
| Editor | Shangguan, Dongkai |